QFN-64 (9 x 9 mm body width, 3.8 x 3.8 mm center pad, 0.5 mm pin pitch) stainless steel solder paste stencil.
Stencil Dimensions: 0.9" x 1.3" x 0.004"
Please note: If the stencil footprint has a center thermal pad (shown as a single pad in the PCB and Stencil datasheets), the stencil may contain several smaller apertures (windows) that together align solder paste over the single center pad on the PCB.